Inspection of BGA is very important and necessary process that helps to find and remove the defects before final assembly. These days BGA X-ray inspection is the best suitable and efficient method of inspecting BGA as one cannot “see” each of the solder joints through direct visual observation. Also, the inspection through x-ray helps to check for Shorts Post Reflow and Consistent Reflow Underneath the Entire Package etc. Get now the top 5 reasons why we should go for BGA Inspection using x-rays for each location, read this Instructable completely or call at 847-797-9250.
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